Innovation Center/Pilot Facility

True innovation requires not only thought and talent, but also tools.   Oracle's Innovation/Pilot Facility represents a tool that provides extraordinary opportunities to ‘go where no packaging has gone before'.  We enjoy taking advantage of that opportunity, and we do so often.

  • Supports product development in target markets
  • Combination adhesive laminator/extrusion coater
  • Processes:
    • Co-extrusion coating/laminating
    • Dry bond laminating
    • Thermal Laminating
    • Solution Coating
    • Slitting/Rewinding
  • 20" web width
  • Enclosed, conditioned, clean room type environment
  • Superior short-run capabilities
  • Rapid sample production at lower cost than production equipment
  • Well positioned to support product development in target markets